ULVAC’s sputtering systems have the best track record in the industry.

[su_spoiler title=”Holizontal In-line Type Sputtering System SCH Series” open=”yes” style=”fancy” icon=”chevron-circle”]

The SCH Series are horizontal in-line sputtering systems for
deposition of transparent conductive films and other metal films.
They can be used to deposition films such as back contact
and barrier layers in solar cell production lines.

[su_spoiler title=”Multi Chamber Type Equipment ENTRONTM N300″ open=”yes” style=”fancy” icon=”chevron-circle”]

ENTRON N300 is the cluster type deposition system which equipped
the process technology of next generation semiconductor.
It offers the critical process of the next-generation semiconductor,
such as “Cu Barrier Seed PVD for TSV”, “Aluminum Emitter Wiring PVD for
Large Diameter Substrate Power Devices”, and “Aluminum Re-Distribution
Layer PVD and Under Bump Metal PVD for High-Density Packaging”.
Furthermore, all user will satisfied by the most environmentally-friendly concept as an
aggregate of energy-saving technologies in ENTRON-series. [/su_spoiler]

[su_spoiler title=”Sputteing System for Optical Filters and Coating ULDiS Series” open=”yes” style=”fancy” icon=”chevron-circle”]

The ULDiS series is the digital sputtering system that has enhanced
the Meta Mode and realized the high-quality optical filters and coatings.[/su_spoiler]

[su_spoiler title=”Batch-type Sputtering System ” open=”yes” style=”fancy” icon=”chevron-circle”]

Batch-type Sputtering System SX series is for batch type sputtering system
for research & development and small production application.[/su_spoiler]

[su_spoiler title=”Backside Metalization Sputtering System ” open=”yes” style=”fancy” icon=”chevron-circle”]

SRH Series is production system for deposition of metallic films for power device,
WL-CSP, or UBM or similar application.

[su_spoiler title=”In-line Sputtering Systems STD Series” open=”yes” style=”fancy” icon=”chevron-circle”]

SPW Series is a equipment that can be sputtered optical thin film
and metal etc multilayer film on plastic film.Gas separation chamber
for batch processing of high-function multilayer films.[/su_spoiler]

[su_spoiler title=”Single-substrate Sputtering Systems SMD Series / SMD-X Series” open=”yes” style=”fancy” icon=”chevron-circle”]

The SMD Series are single-substrate sputtering systems for deposition
of films such as metal films and ITO films. ULVAC has delivered a
large number of these systems, for use in a wide range of
production environments. ULVAC responds rapidly to
feedback from production sites to improve the reliability of these models.[/su_spoiler]

[su_spoiler title=”Ultra-High Vacuum Sputtering System for R&D MPS Series” open=”yes” style=”fancy” icon=”chevron-circle”]
The use of long throw sputtering enables better film thickness uniformity,
and the diagonal incidence configuration is ideal for co-sputter and multilayer films.[/su_spoiler]

[su_spoiler title=”Compact Sputter for Research & Development CS-L” open=”yes” style=”fancy” icon=”chevron-circle”]

It is possible to arrange for various module conbination;
Atmospheric cassette, Single piece, Atmospheric transfer,
Vacuum transfer. Compact design integrated with control unit.

[su_spoiler title=”Compact Sputter ACS-4000″ open=”yes” style=”fancy” icon=”chevron-circle”]
Compact sputtering system is available for research and development of
multi layer thin film, compound materials or other devices,
using automatic process operation by PC.
Also more large size substrate (4 inch dia.) than ever system is available.[/su_spoiler]

[su_spoiler title=”Multi-chamber Sputtering System MLXTM-3000N” open=”yes” style=”fancy” icon=”chevron-circle”]

MLXTM-3000N meets customer’s complicated requests by superior process
flexibility and controllability, and excellent cost performance.[/su_spoiler]

[su_spoiler title=”Multi-chamber Sputtering System ENTRONTM-EX2 W300″ open=”yes” style=”fancy” icon=”chevron-circle”]
Multi-chamber Sputtering System ENTRONTM-EX2 W300 is the latest platform
possible to combine the various process.[/su_spoiler]

[su_spoiler title=”Load-lock type Sputtering System SPH Series” open=”yes” style=”fancy” icon=”chevron-circle”]
Load-lock sputtering system suitable to fully automated production line for
small size parts such as automotive mirrors and plastic moldings.
Lineups are SPH-320/320M for 2 stage processing and SPH340M for 4 stage processing.[/su_spoiler]

[su_spoiler title=”Batch-type Sputtering Systems SV Series” open=”yes” style=”fancy” icon=”chevron-circle”]

Vertical batch-type sputter systems. Series models include the SV-200 disk stamper model,
and carousel types for large-volume substrate processing.[/su_spoiler]

[su_spoiler title=” Load-lock type Sputtering System CS-200″ open=”yes” style=”fancy” icon=”chevron-circle”]
Load-lock type Sputtering System CS 200 is for research & development
and small production application.[/su_spoiler]

[su_spoiler title=”Cluster-type Sputtering System SME-200E” open=”yes” style=”fancy” icon=”chevron-circle”]

SME-200E is cluster type Sputtering system for research and
development and production purpose.[/su_spoiler]

[su_spoiler title=”Magnetic Multilayer Cluster Tool MagestTM S200″ open=”yes” style=”fancy” icon=”chevron-circle”]

MagestTM S200 provides the multi-layer deposition of ultra thin films
under the ultra high vacuum condition and is applicable for the deposition
of various materials by RF or DC sputtering.[/su_spoiler]

[su_spoiler title=”Sputtering and Polymerization Sytem  SPP Series” open=”yes” style=”fancy” icon=”chevron-circle”]

The new developed sputtering and polymerization system integrated with
injection molding system SPP-SERIESenables fully automatic formation
of metallic and protective films on resin substrates used in the
automobile and decoration industries.[/su_spoiler]