Product Fillter

Model: SME

Model: SME

Sputtering System

Flexible installation of process chambers ranging from 1 to 7, depending on the core shape, allows the sputtering deposition system to meet a wide range of process needs, including opto-devices, packaging, MEMS/electronic components, power devices, and communication devices, while achieving high cost performance.

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Features

  • Supports process modules dedicated to various applications.
  • Capable of substrate heating, simultaneous deposition, and rotating deposition.
  • Process chambers can accommodate 1 to 7 chambers.
  • Substrate size：Up to Φ200mm.

Applications

  • Electronic device
  • MEMS
  • Power device
  • LED
  • Communication device

Specifications

Model SME-200E SME-200J SME-200
Substrate size (mm) Up to Φ200
Deposition direction Down
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Chamber configuration 1) Loading/Unloading chambers 1 1 1 or 2
2) Transfer chambers Square Hexagon Octagon
3) Sputtering chambers Max. 3 Max. 5 Max. 7
High vacuum evacuation system TMP or 8" cryopump
substrate transport system Vacuum transfer robot(Single arm type) Vacuum transfer robot (One arm Double Pick) Vacuum transfer robot(Double arm type)