Model: uGmni-300S

Model: uGmni-300S

Sputtering System

Flexible configuration of up to six process chambers, depending on the core shape, enables this multi-chamber sputtering system to support a wide range of applications, including power devices, opto-devices, and RF devices.

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Features

  • Compatible with various applications.
  • Substrate size: Up to Φ300mm.

Applications

  • Power device: Seed and metal layer sputtering
  • MEMS sensor: PZT sputtering and etching
  • Optical device: VCSEL etching
  • Packaging: Descum ashing
  • Communication device: PE-CVD of insulating film and etching