Model: ENTRON-EX W300

Model: ENTRON-EXX

Sputtering System

The ENTRON-EX W300 is a versatile, multi-chamber platform designed to support the fabrication of a wide variety of cutting-edge products, including semiconductor logic, memory (DRAM, NAND, next-generation non-volatile memory), and packaging. By integrating a variety of process modules, such as PVD, pre-clean, heating, and cooling, it can flexibly adapt to customer needs.

This is the legacy model of the ENTRON-EXX.

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Features

  • A long-selling model widely adopted in mass production, continuously improved to enhance fabrication capability, space efficiency, and operational stability.
  • Capable of accommodating up to 10 modules (PVD, pre-clean, heating, cooling).
  • Achieves a mechanical throughput of more than 100 WPH using ULVAC’s proprietary transfer robot.
  • The ENTRON-EX W300 Single platform is ideal for mini-fab concepts as well as specialized processes, while the ENTRON-EX W300 Tandem platform is optimized for high-volume production, offering flexible solutions tailored to customers' needs.
  • Equipped with the EES system for real-time monitoring and management of machine conditions.

Applications

  • Fabrication of semiconductors: Logic, DRAM, NAND, NVM
    Deposition processes for semiconductor fabrication, including metal interconnects, patterning masks, electrodes, and other functional films.