Product Fillter

Model: SIH, SCH

Model: SIH,SCH

Sputtering System

These systems are ideal for depositing a variety of materials and can accommodate a wide range of substrates. Featuring ULVAC's proprietary transfer system, they offer excellent cost performance and provide a highly versatile solution for various applications, making it an ideal in-line vertical pass-by type deposition systems.

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Features

  • Continuous automated production enabled by the stocker chamber.
  • Low cost.
  • Achieves space-saving and reduced wiring.
  • Easy substrate size change with the carrier transfer system.

Applications

  • Electronic device

Specifications

Model SIH SCH
Deposition method Pass-by
Deposition direction Up or Down