Model: SRH
Sputtering System
Production-scale sputtering system ideal for packaging and power device applications. Metal deposition is performed with high precision, forming reliable connection layers.
Product Fillter
Model: SEGul-200
Features
- Film thickness & resistance distribution within ±10% (Φ200mm area).
- No special gas abatement system required as sputtering system.
- Up to 3 process chambers can be installed.
Supporting both development and production-scale operations. - Compatible with substrates ranging from Φ50mm to Φ200mm.
RaSE Method
- Process temperature: 600 to 800°C
- n-type GaN growth through doping
- Gases used: Ar, N2
Applications
- Power device
- Communication device
- μLED