Product Fillter

Model: CS

Model: CS

Sputtering System

This is a single-chamber sputtering system designed to support applications from research and development to small-scale production. It has been redesigned with a focus on ease of use, leveraging existing process data and expertise.

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Features

  • Supports multi-layer deposition.
  • Capable of data logging.
  • Substrate size: Up to Φ300mm (deposition performance is guaranteed up to Φ190mm).
  • Automated multi-layer deposition enabled through recipe control.
  • The load-lock chamber cassette can accommodate up to 5 trays, which are automatically transferred by a manipulator.

Applications

  • R&D, and small-scale production for electronic components