Ashing System

Luminous NAシリーズLuminous NA Series

This ashing system can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.

Ashing System for Panel Lerel Packaging

ULVAC offers environmentally-friendly, high-productivity technologies for resist removal,
which is essential in production processes for electronic and semiconductor devices.